SOP-42Q-MES0153 Solder Paste Material Control

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42Q Home > Production > Solder Paste Material Control

 

 

 Production 
Solder Paste Material Control
Version MES 15.77
Revision C1

 

 

 

 

 

Introduction

Solder Paste is an application able to help plants to control the storage and use of Solder Paste materials to avoid human errors and lapses. The project has the standard process and creates error-proofing of Solder Paste control, to ensure plants comply with the varying Solder Paste part number’s storage life and use life limits, and ensuring a constant environment, to stop out-of-specs solder paste from being used in production.

This System provides a standard process that includes the following steps:

  1. Refrigeration In
  2. Refrigeration Out
  3. Thaw Start
  4. Thaw End
  5. Stirring
  6. Open Jar
  7. Load Solder-Paste
  8. Unload Solder-Paste
  9. Scan board
  10. Solder-Paste Scrap

Also supplies reports for Solder Paste status view and Solder Paste tracking.

In order to avoid solder paste waste, the standard solder paste control process also applies to the First In First Out approach. This solder paste FIFO control is very flexible and it could be configured by the plant level. The Refrigerator & Thawing process applies this FIFO control by user pre-configuration in the system setting. 

 

Configuration

Before starting the Solder Paste process, there are some system settings and material control to configure first;

The following are the detailed configurations:

  • System Setting:
  1. Solder Paste Refrigeration/Thaw Process.
  2. Solder Paste Refrigeration/Thawing FIFO setting.
  • Material Labeling: Generate/print solder paste barcode/PN
  • Solder Paste Material Control: Set the control parameters of the solder paste material.

 

System Setting

There are switches in the System Setting function.

  1. Solder Paste Refrigeration Process: To define whether to control the solder paste refrigeration process.
  2. Solder Paste Thaw Process: To define whether to control the solder paste thawing process.
  3. Solder Paste Refrigeration FIFO: If the value of the item is YES then the Refrigeration FIFO(First In First Out) will be controlled.
  4. Solder Paste Thawing FIFO: If the value of the item is YES then the Thawing FIFO will be controlled.f

To set the switches, follow the steps below:

  1. Select Administration --> Traceability Administration --> System Setting.
  2. Select the MSD Control tab.
  3. Set the value of Solder Paste Refrigeration process, Solder Paste Thaw Process, Solder Paste Refrigeration FIFO, Solder Paste Thawing FIFO.
  4. Click the Update button.

Figure 1: System Setting - Solder On Board

Figure 1- System setting-Solder On Board.png

 

  • If the switch ‘Solder Paste Refrigeration/Thaw Process’ is opened (Yes) then all solder paste Refrigeration/Thaw related functions (steps) can be used normally ( the pages show, and can edit).
  • If the switch ‘Solder Paste Refrigeration/Thaw Process’ is closed (No) then all solder paste Refrigeration/Thaw related functions (steps) can not be used  ( the pages show, but can not edit). 

 

 

Material labeling

Material Labeling is the function of printing material barcodes.

Note: There is one interface to import materials into the 42Q Solder Paste database for some plants that do not use this material labeling function to generate material barcodes.

  1. Select Shop Floor Control--> Incoming Traceability --> Material Labeling.
  2. Select the Receipt Traveler No./ Number, press Enter key.
  3. Set the values of the material.
  4. Click the Submit button.
  5. The material barcode will be generated and the label printed successfully.

Figure 2: Material Barcode

Figure 3 - Material labeling-material barcode.png

Solder Paste Material Control

Solder Paste Material Control is the function that users can set or configure the Solder Paste material, such as Storage Temperature, Min storage time, ambient humidity, and floor life, etc.

  1. Select Shop Floor Control--> Production Control --> Solder Paste Material Control.
  2. Select the Add/Edit/Delete to set the solder paste material control setting.

Figure 3: Solder Paste Material Control Main Page

Figure 4 - Solder Paster Material Control Main Page.png

Users can add, edit, and delete the Solder Paste material control settings.

 

Add Solder Paste Control

  1. Select the Add button to add one new Solder Paste control.
  2. Input the values of items.
  3. Click Save to submit the solder paste control.
  4. Or click Reset to clean all the text fields.

Figure 4: Add Solder Paste Control

Figure 4- Add Solder Paste Control.png

  • Solder Paste MPN: The manufacturer Part Number of Solder Paste material. It can not be blank.

There are four levels of Solder Paste control.

  • N/A
  • Product Part Number
  • Family ID
  • Tag

For the same MPN (Manufacturer Part Number), the priority of the Solder Paste material control is; Production part number, tag, family ID, then N/A. That means the system will first use the Product/BOM part number level Solder Paste material control if it is blank, then use the Tag level Solder Paste material control, then use Family ID level solder paste material control, and to use the N/A level Solder Paste material control the last.

Following is the description of the priority.

Priority Type Description Comment
Pri(1) Product Part Number The product Part Number is the BOM Part Number.

This option means all the materials from this manufacturer part number (MPN) and in the Product/BOM part number use this solder paste material control setting. 

 

Pri(2)  Tag  This option means all the materials from this manufacturer part number(MPN) and with this tag use this solder paste material control setting.  Tag must have been defined at MDS. 
Pri(3) Family ID This option means all the materials from this manufacturer part number(MPN) and with this Family use this solder paste material control setting. Family ID must have been defined at MDS. Users need to define the Conduit and Conduit_ShopFloorID

At server information module. 

Pri(4)  N/A   This option means all the materials from this manufacturer Part Number(MPN) use this solder paste material control configuration/setting.

 

 

 

If users select the radio button ‘Tag’, then there will be a text field item named ‘Tag’ and the values will show in a dropdown list.

Note: The Tag is maintained at Part Maintenance in Shop Floor Control configuration. Users need to define the Conduit and Conduit_ShopFloorID at the Server information module.

 

Figure 5: Server information example 

Figure 6- Server information example-.png

  • Optimal Storage Temp: The optimal storage temperature of the Solder Paste material.
  • Storage Temp Dev(+/- ): Storage temperature deviation. This is the deviation temperature that can be upper or lower than the optimal storage temperature. If the real storage temperature for the Solder Paste material is not between (Optimal Storage Temp - Storage Temp Dev) and (Optimal Storage Temp + Storage Temp Dev), the system will pop up error information.
  • Min Storage Time(Hr): The min time of the storage for the solder paste material. If the storage time is less than the mini-storage time, the system will pop up error information for it.
  • Min Thaw Time(Hr per KG): The min time of the thaw for the solder paste material. If the thaw time is less than the mini thaw time, the system will pop up error information for it.
  • Max Storage End Thaw End Time(Hr): This time is the max time of all the processes for the solder paste material. From refrigeration in, refrigeration out, thaw start, thaw end, open Jar, load material till to scan board.
  • Max Allowed Thaw Cycle(Count): The max thaw times for the solder paste material. For example: if the max allowed thaw cycle set to 2, that means this solder paste material can have 2 thaw processes. If more than 2, the system will pop up with error information.
  • Enforce Stirring:  Yes/No. 
    • If set to Yes, the function Stirring (Production > 100% Traceability > Production Part Traceability > Touch Solder paste) is enabled. And if the solder paste material was not stirring, it cannot do the next process (open jar) directly.
    • If set to No, The solder paste material no need to do the stirring process, can be the next process ( open jar) directly.
  • Stencil Life(Hr): This time is the Solder Paste material that stays at the stencil. Once the Solder Paste material is loaded on the production line workstation, the system will start to count the time.
  • Stencil Idle Max Tim(Hr): This time is to control the time between scanning two boards. The system will start to count time once the first board is scanned.
  • Floor Life(Hr): The floor life of the Solder Paste material. The system will start to count the time when the material was opened (open jar).
  • Shelf Life(Day): The shelf life of the Solder Paste material. The system will start to count the time when the material label generated (The create time of the material barcode).
  • Ambient Humidity Low Limit(%): The lowest ambient humidity of the solder paste material.
  • Ambient Humidity High Limit(%): The highest ambient humidity of the solder paste material.
  • Ambient Temp Low Limit(%): The lowest ambient temperature of the solder paste material.
  • Ambient Temp High Limit(%): The highest ambient temperature of the solder paste material.

Edit Solder Paste Control

  1. Select Shop Floor Control-->Solder Paste Material Control.
  2. Select one of the Solder Paste control records, then click the Edit button.
  3. Change the special values of Solder Paste control.
  4. Click the Save button.

Delete Solder Paste Control

  1. Select Shop Floor Control-->Solder Paste Material Control.
  2. Select one of the Solder Paste control records, then click the Delete button.
  3. It prompts a message to confirm the deletion.
  4. Click the Yes button to delete the selected Solder Paste control.

 

Standard Process

Users can do the Solder Paste process through the Solder Paste Touch menu after the configurations are done.

Navigate to Production -> 100% Traceability -> Production Part Traceability -->Touch (Solder Paste)

For more details please visit: Production Part Traceability   Figure 6: Solder Paste Touch App Navigator Main Page 

Figure 7- SP touch App main page.png

 

Production Setup

Before loading, and unloading Solder Paste material and scan board, users need to config the production line and workstation through the Production Setup module.

 

Load/unload material

  1. Select Production-->Production Part Traceability-->Touch (combines load/unload materials) (PTS).
  2. Click Load Material Icon.
  3. Input Workstation, Solder Paste material, New Feeder Barcode, Station Location, then click Send button.
  4. Select the Report to show the detailed load material information.

PTS loading material function has the Solder Paste material control as follows:

  • The status of the current Solder Paste material must be ‘Open Jar’ status (otherwise the system will prompt a warning message).
  • The shelf-life of the current Solder Paste material must not be reached.
  • The floor-life of the current Solder Paste material must not be reached.
  • If the first loading material operation is successful the status of the current solder material needs to be changed to ‘Load Solder-Paste to Stencil’ status and write related process operation data to related DB new process operation table.

 

PTS unloading material function has the solder paste material control as follows:

  • The status of the current solder paste material must be‘Load Solder-Paste to Stencil’ status (otherwise system prompt warning msg).
  • If the unloading material operation is successful the status of the current solder material needs to be changed to ‘Unload Solder-Paste from Stencil’ status and write related process operation data to the related DB new process operation table.

Scan Board

  1. Select Production-->Production Part Traceability-->Touch (combines load/unload materials) (PTS)
  2. ClickScan Board Icon
  3. Input Workstation Available
  4. Input Board Barcode, then press Enter
  5. Select the Scanned button and show the scan board history.

 

 PTS scanning board function has Solder Paste material control as follows:

  • If the shelf life of the current location Solder Paste material is reached then scanning board operation prompts an error message such as ‘Solder Paste material shelf life is reached’.
  • If the floor life of the current location Solder Paste material is reached then the scanning board operation prompts an error message such as‘Solder Paste material floor life is reached’.
  • If the stencil life of the current location Solder Paste material is reached then the scanning board operation prompts an error message such as ‘Solder Paste material stencil life is reached’.
  • If the stencil idle max time of the current location Solder Paste material is reached then the scanning board operation prompts an error message such as ‘Solder Paste material stencil idle max time is reached’.

 

Reports

There are two reports for the solder paste material.

  • Solder Paste Status Report
  • Solder Paste Process Tracking Report

 

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